Camera PMIC in a wafer-level chip-scale footprint
The Texas Instruments TPS657051YZHT is a power-management IC purpose-built for camera modules, integrating multiple voltage rails and sequencing logic into a single 16-DSBGA (2.24x2.16) package.
Availability is limited to surplus and broker-channel stock.
Package and mounting — DSBGA layout realities
Surface-mount assembly requires a solder-paste stencil matched to the ball diameter and a reflow profile compatible with the package's moisture sensitivity.
