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Texas Instruments TPS630252YFFR — Power Management (PMIC / Gate Driver)

TPS630252YFFR Buck-Boost Regulator, 3.5 A Switch, 2.5 MHz

MPNTPS630252YFFR
End of Life

Texas Instruments TPS630252YFFR, Step-Up/Step-Down Buck-Boost Regulator, Fixed 3.3 V Output, 2.3 V to 5.5 V Input, 3.5 A Switch, 2.5 MHz, Synchronous Rectifier, 20-DSBGA, -40°C to 85°C.

$2.7200Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

TPS630252YFFR specifications
ParameterValue
Output typeFixed
MountingSurface Mount
Voltage - input5.5V
Voltage - output (Min (Fixed))3.3V
Output current3.5A (Switch)
Frequency - switching2.5MHz
I/O channels1
Operating temperature-40°C ~ 85°C (TA)
FunctionStep-Up/Step-Down
TopologyBuck-Boost
PackageTape & Reel (TR) Cut Tape (CT)
Case20-UFBGA, DSBGA
Output configurationPositive
Synchronous rectifierYes

Product details

Fixed 3.3 V rail from a single-cell Li-Ion — no divider resistors needed

That fixed output means no external feedback resistor divider, saving two components and one potential noise injection point on a dense board. The 3.5 A switch current limit is the real headroom number: in a buck-boost, the switch handles the full input current plus the boost ratio, so a 3.5 A switch typically supports a continuous output of 2 A to 2.5 A depending on Vin and the inductor ripple. The 2.5 MHz switching frequency keeps the inductor small — 1 µH to 2.2 µH range — and pushes the switching noise above the AM band, which helps in RF-sensitive portable gear.

2.5 MHz switching — inductor size and noise placement

At 2.5 MHz the fundamental ripple is at 2.5 MHz and its harmonics, well above the 1.6 MHz AM radio band and most audio amplifier bandwidths. That frequency also lets you use a 1.0 µH to 2.2 µH inductor with a saturation rating above the 3.5 A switch peak — a 2.2 µH, 4 A part in a 3×3 mm footprint is typical. No external compensation is needed — the TPS63025 family uses internal compensation, so the BOM stays tight.

20-DSBGA — what the 0.4 mm pitch means for assembly

The 20-DSBGA is a 0.4 mm pitch wafer-level chip-scale package — 2.24 mm × 1.73 mm body, no mould compound. That demands a solder-mask-defined pad with a 0.225 mm NSMD opening and a 0.3 mm copper pad, plus a 0.1 mm solder-paste stencil aperture.

That means TI is still manufacturing this variant in the 20-DSBGA package, and the base product number TPS630252 is the design-in anchor — the YFFR suffix is the DSBGA reel variant. If you need a larger package for prototyping, the TPS630252 in a 12-pin QFN (RUK) is the same silicon in a 0.5 mm pitch, easier to hand-solder. No official second source is listed; this is a single-sourced TI part. For production, the BOM should carry a sole-source flag.

Frequently asked questions

Does TPS630252YFFR require external compensation?

No. The TPS63025 family uses internal compensation. The only external power components are the inductor and input/output capacitors — no external resistor or capacitor network for loop stability.