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Texas Instruments TPS63010YFFR — Power Management (PMIC / Gate Driver)

TPS63010YFFR Buck-Boost Regulator – 2A, 2.4 MHz, DSBGA-20

MPNTPS63010YFFR
Active

Texas Instruments TPS63010YFFR, a synchronous buck-boost switching regulator, adjustable output, 2A switch, 2.4 MHz switching frequency, in a 20-DSBGA package.

$2.6000Ref. price · indicative, final on quote
Packaging20-UFBGA, DSBGA
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TPS63010YFFR specifications
ParameterValue
Output typeAdjustable
MountingSurface Mount
Voltage - input5.5V
Voltage - output5.5V
Voltage - output (Min (Fixed))1.2V
Output current2A (Switch)
Frequency - switching2.4MHz
I/O channels1
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
FunctionStep-Up/Step-Down
TopologyBuck-Boost
Case20-UFBGA, DSBGA
Output configurationPositive
Synchronous rectifierYes

Product details

What the 2A switch rating means for your load

The TPS63010YFFR integrates a 2A switch in a buck-boost topology, meaning the inductor current limit is the hard ceiling for the output. For a 1.8 A continuous load at 3.3 V from a 3.7 V Li-ion battery, the switch current will be close to the limit during step-up — budget derating and check the inductor saturation current against the peak switch current.

Input and output voltage envelope

Input range is 2V to 5.5V, covering single-cell Li-ion, 3.3V and 5V rails. Output is adjustable from 1.2V to 5.5V — the feedback divider sets the voltage; the datasheet gives the resistor values for common outputs.

Switching frequency and external component sizing

Fixed 2.4 MHz switching frequency lets you use a 1 µH to 2.2 µH inductor and 10 µF output capacitor — small enough for space-constrained designs. The trade-off is that the high-frequency loop must be physically tight on the PCB; the DSBGA package places the switch node and input cap close, but the layout must keep the ground return path short to avoid ringing that eats into the efficiency.

Package and layout constraints

The 20-DSBGA package has a 0.4 mm ball pitch — a 4-layer PCB with microvias is the practical minimum for fan-out. Two-layer boards will struggle to route all signals and may force vias under the package, which is not recommended.

Production status and ordering

It is ROHS3 compliant.

Frequently asked questions

Does TPS63010YFFR require external compensation?

The TPS63010YFFR uses internal compensation — no external RC network is needed. The datasheet application circuit shows the recommended inductor and capacitor values for stable operation across the input and output range.

Is TPS63010YFFR pin-compatible with other TPS63010 variants?

The base product number TPS63010 shares the same die and pinout across package options. The YFFR suffix specifically indicates the 20-DSBGA package. Other TPS63010 variants in different packages (e.g., QFN) are not pin-compatible due to different ball/pad layouts.