Fixed 2.1 V rail for Bluetooth transceivers
A single output in a 6-UFDFN package measuring 1.45x1 mm keeps the solution area small enough for compact wireless dongles, wearables, and IoT sensor nodes.
Package and temperature — what the board sees
The 6-UFDFN package (supplier device package 6-SON, 1.45x1 mm) is a surface-mount, leadless package with a small thermal pad underneath. The solder paste stencil aperture for the centre pad needs to match the datasheet recommendation to get the thermal vias right. The part is not rated for under-hood or engine-bay temperatures, but it handles the thermal swing of a parked car in summer or a factory floor without issue.