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Texas Instruments TPS62665YFFR — DC-DC Power Modules

TPS62665YFFR 6-MHz 1-A Step-Down Buck Converter, 6-DSBGA

MPNTPS62665YFFR
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Texas Instruments TPS62665YFFR, step-down buck converter, fixed 1.2 V output, 1 A, 6 MHz switching, 6-DSBGA package, -40 to 85 °C.

$0.8565Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

TPS62665YFFR specifications
ParameterValue
Output typeFixed
MountingSurface Mount
Voltage - input5.5V
Voltage - output (Min (Fixed))1.2V
Output current1A
Frequency - switching6MHz
I/O channels1
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
FunctionStep-Down
TopologyBuck
Case6-UFBGA, DSBGA
Output configurationPositive
Synchronous rectifierYes

Product details

6 MHz buck — why the switching frequency matters

The TPS62665YFFR is a fixed-output 1.2 V step-down (buck) converter from Texas Instruments, switching at 6 MHz. That switching frequency is the headline spec: it lets you use a 0.47 µH or 1 µH inductor and 4.7 µF output cap in 0402 or 0603 case sizes, collapsing the power-stage footprint to roughly the area of the DSBGA package itself. For space-constrained designs — wearables, IoT nodes, handheld instruments — this is the regulator that fits where a lower-frequency part would need twice the board real estate.

1 A continuous — load budget and thermal reality

Rated for 1 A continuous output. In a 6-DSBGA package with no exposed pad, the thermal path is through the solder bumps and the PCB copper.

Input range and output — what the BOM sees

Output is fixed at 1.2 V — no resistor divider, no feedback trim.

DSBGA layout — what the board needs

6-bump DSBGA, 0.5 mm pitch. The bumps are solder-mask-defined; the PCB pad diameter should be 0.25 mm with a 0.3 mm solder-mask opening. Route the input cap (4.7 µF, 0603) within 2 mm of the VIN bump, output cap similarly close to VOUT. The 6 MHz edge rate demands short loops — a 10 nF high-frequency bypass cap directly at the IC bumps is not optional. Stencil aperture for the bumps should be 0.28 mm square, 100 µm thick.

Lifecycle and ordering

No direct replacement or second-source alternate is listed by TI, but the TPS62665 family shares the same pinout and control loop, so other fixed-output voltage variants (0.8 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) are drop-in compatible if the output voltage changes.

Frequently asked questions

What is the difference between TPS62665YFFR and TPS62665YFFT?

The TPS62665YFFR and TPS62665YFFT are the same silicon in the same 6-DSBGA package. The difference is the shipping medium: YFFR ships in Tape & Reel (7-inch reel, 3000 units), while YFFT ships in a smaller cut-tape or partial-reel quantity. Electrical characteristics are identical.

Does TPS62665YFFR have a direct replacement or alternative part?

No direct replacement or official second-source alternate is listed by Texas Instruments. Other TPS62665 family variants (TPS62665YFFx) with different fixed output voltages share the same pinout and package, so they are drop-in compatible if the output voltage requirement changes.