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Texas Instruments TPS62621YFFT — Power Management (PMIC / Gate Driver)

TPS62621YFFT Texas Instruments Buck Regulator, 600mA, 6MHz

MPNTPS62621YFFT
Active

Texas Instruments TPS62621YFFT, Step-Down Buck Regulator, Fixed 1.8V Output, 600mA, 6MHz Switching, 6-UFBGA DSBGA Package, -40°C to 85°C.

$1.7400Ref. price · indicative, final on quote
Packaging6-UFBGA, DSBGA
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TPS62621YFFT specifications
ParameterValue
Output typeFixed
MountingSurface Mount
Voltage - input5.5V
Voltage - output (Min (Fixed))1.8V
Output current600mA
Frequency6MHz
I/O channels1
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
FunctionStep-Down
TopologyBuck
Case6-UFBGA, DSBGA
Output configurationPositive
Synchronous rectifierYes

Product details

What the 6 MHz switching buys you on a tight board

The TPS62621YFFT is a 600 mA step-down (buck) converter from Texas Instruments, fixed at 1.8 V output, in a 6-bump DSBGA package. What makes it stand out on a bench is the 6 MHz switching frequency — that lets you use a much smaller inductor and output capacitor than a 1-2 MHz part, which is the whole point when you're squeezing a power rail into a space the size of a fingernail. The synchronous rectifier (internal FET for both high-side and low-side) keeps efficiency up and removes the need for an external Schottky diode — one less part to place and one less failure point to trace when a board comes back dead.

Active production — no scavenger hunt needed

It's ROHS3 compliant, which means no exemption issues for EU or similar markets. The package is a 6-pin UFBGA / DSBGA (0.4 mm pitch ball grid array), so the board needs a soldermask-defined pad and a stencil that can handle the small aperture — standard for any modern phone or wearable layout.

What the temp range and package mean for a repair bench

If you're fixing a board that lived inside a climate-controlled box, this is fine. If it came out of an engine bay or a rooftop enclosure that sees 105°C, this part will be the scorch mark you find first. The 6-DSBGA package means rework is possible with hot air, but you'll want a preheat plate underneath to avoid warping the board. Moisture sensitivity level (MSL) isn't in the spec here, but most DSBGA parts from TI are MSL-1 or MSL-2 — still, bake before reflow if the bag seal is broken.

Frequently asked questions

How can I order TPS62621YFFT or check availability?

Submit an RFQ for your BOM quantity and we'll respond with a firm offer.