The TPS62612YFDT is a Texas Instruments step-down (buck) regulator switching at 6 MHz — that clock rate lets you use a 1 µH or smaller inductor and a 4.7 µF output capacitor, shrinking the total power-stage footprint to a few mm². For a board where every mm² is budgeted (wearable, IoT sensor, portable medical), this part saves real estate over a 1-2 MHz regulator that needs a 4.7 µH inductor and 10 µF cap.
Fixed 1.5 V rail — core supply for low-voltage logic
Output is fixed at 1.5 V — no external resistor divider needed. That voltage is a common core supply for FPGAs, MCUs, and wireless SoCs (e.g., CC13xx, certain STM32L4 parts). If your BOM calls for an adjustable output, this fixed version won't fit; look at the TPS62612 adjustable variant instead.
Input range and current — battery to regulated bus
The 350 mA output is sized for a small FPGA core (e.g., iCE40UP5K) or a wireless module drawing 200-300 mA peak. At 350 mA continuous, the 6-DSBGA package's thermal impedance (approx 150 °C/W) keeps junction temperature under 100 °C at 85 °C ambient — no derating needed for most designs.
6-DSBGA — footprint and layout
The 6-DSBGA (0.9 mm × 1.3 mm typical, 0.4 mm pitch) is a wafer-level chip-scale package. No exposed pad — all six balls carry the thermal path through the PCB vias. A 4-layer board with thermal vias under the package is recommended; a 2-layer board can work if the output current stays below 200 mA and the ambient is under 60 °C. The solder paste stencil aperture should match the ball diameter (0.25 mm typical) to avoid bridging.