2.5 A buck converter in a 2.24×2.16 mm DSBGA
Output is adjustable down to 0.5 V, with factory-programmed preset options at 0.96 V, 1.16 V, and 1.4 V. That covers the core voltages for many low-power MCUs, FPGAs, and wireless SoCs without an external resistor divider.
The 16-DSBGA (2.24x2.16 mm) package is a wafer-level chip-scale package with 0.50 mm ball pitch. Board assembly needs a solder mask defined pad and a stencil aperture matched to the ball diameter; the datasheet's land pattern recommendation is non-negotiable for reliable solder joints.