Tiny 3 MHz buck for space-constrained 1.5 V rails
Package reality: 8-DSBGA means reflow only
The TPS62321YEDT comes in an 8-pin DSBGA (0.5 mm pitch, 0.4 mm ball diameter) — a tiny wafer-level chip-scale package. This is not a hand-solderable part; it requires a solder-paste stencil and reflow oven. The footprint is essentially the die size, so the PCB land pattern must match TI's recommended layout exactly to avoid solder bridging. For prototyping or rework, you will need a hot-air rework station with a fine nozzle and a steady hand. The DSBGA package also demands careful handling — moisture sensitivity level (MSL) is typically 1 for this family, but verify the bake requirements if the part has been exposed to ambient humidity.
No official successor is listed on the product record. If you are starting a new design, look at TI's current TPS623xx family for pin-compatible or functionally equivalent alternatives.