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Texas Instruments TPS61200DRCRG4 — DC-DC Power Modules

TPS61200DRCRG4 Boost Converter, 0.3V-5.5V Input, 1.2A Switch

MPNTPS61200DRCRG4
End of Life

Texas Instruments TPS61200DRCRG4, step-up boost converter, 0.3 V to 5.5 V input, 1.8 V to 5.5 V adjustable output, 1.2 A switch current, synchronous rectification, 1.25 MHz to 1.65 MHz switching frequency, 10-VSON (3x3 mm) package, -40°C to 85°C operating temperature.

$0.9900Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

TPS61200DRCRG4 specifications
ParameterValue
Output typeAdjustable
MountingSurface Mount
Voltage - input5.5V
Voltage - output5.5V
Voltage - output (Min (Fixed))1.8V
Output current1.2A (Switch)
Frequency - switching1.25MHz ~ 1.65MHz
I/O channels1
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR)
FunctionStep-Up
TopologyBoost
Case10-VFDFN Exposed Pad
Output configurationPositive
Synchronous rectifierYes

Product details

0.3 V minimum input — the battery-extraction boost

The TPS61200DRCRG4 is a synchronous step-up (boost) converter from Texas Instruments that starts up and regulates from an input voltage as low as 0.3 V. The 1.2 A switch current limit sets the output power ceiling — at 3.3 V out from a 1.5 V input, budget around 1.5 W continuous before the switch hits its limit.

Synchronous rectification — one less Schottky on the BOM

This part integrates a synchronous rectifier, so there is no external Schottky diode in the boost path. That saves a component, shrinks the layout, and improves efficiency at light loads compared to a non-synchronous boost with a discrete diode. The switching frequency runs between 1.25 MHz and 1.65 MHz, which keeps the inductor small — typically a 2.2 µH to 4.7 µH shielded part in the 3x3 mm footprint.

10-VSON exposed pad — thermal design is not optional

The package is a 10-VFDFN with an exposed pad, also called 10-VSON (3x3 mm). Surface-mount assembly with standard lead-free reflow — the exposed pad does not require a special profile, but the solder stencil aperture under the pad should be segmented to avoid voiding.

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