TPS3703A5180DSER

Texas Instruments

Texas Instruments TPS3703A5180DSER, Simple Reset/Power-On Reset, 1.8V threshold, Active Low open-drain output, 140ms min reset timeout, 6-WFDFN (6-WSON 1.5x1.5), -40°C~125°C.

Texas Instruments TPS3703A5180DSER
[IN STOCK] In Stock: 40 pcs
$2.54/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TPS3703A5180DSER specifications
Parameter / AttributeSpecification / Value
TypeSimple Reset/Power-On Reset
MountingSurface Mount
Voltage - threshold1.8V
Number of voltages monitored1
Operating temperature-40°C~125°C(TJ)
ResetActive Low
OutputOpen Drain or Open Collector
PackageTape & Reel (TR); Cut Tape (CT)
Reset timeout140ms Minimum
Case6-WFDFN

Technical details

Window supervisor for 1.8V rails – what the 140ms timeout buys you

The TPS3703A5180DSER is a high-accuracy window supervisor from Texas Instruments, monitoring a single 1.8V supply rail. The active-low open-drain output asserts reset when the monitored voltage drifts outside the window, and holds reset for a minimum of 140ms after the rail returns to tolerance — long enough for downstream FPGAs or MCUs to finish their power-on reset sequence before the core starts executing code. The 1.8V threshold is a direct match for low-voltage core logic in modern SoCs and FPGAs. If your rail is 1.2V or 3.3V, this is the wrong threshold — confirm the BOM rail voltage before ordering. The open-drain output lets multiple supervisors share a common pull-up resistor to a different voltage domain (e.g., 3.3V), which is useful for sequencing multiple rails with a single reset signal.

Availability is confirmed through our sourcing desk — quoted and ordered against your BOM quantity. No stock-holding claim; we source per RFQ.

Package and temperature – small footprint, wide thermal envelope

Housed in a 6-WSON (1.5x1.5 mm) package, the TPS3703A5180DSER fits in tight layouts where board space is at a premium. The 125°C ceiling is the key spec — many simple reset ICs top out at 85°C or 105°C, so this part eliminates a thermal bottleneck in high-temp designs.

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