TPS22933ARSER

Texas Instruments

Texas Instruments TPS22933ARSER, Source Selector Switch, P-Channel, 3:2 Input:Output, 75mA max output, 2.5V~12V supply, 65µs turn-on delay, 8-UQFN package, -40°C~85°C.

Texas Instruments TPS22933ARSER
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[IN STOCK] In Stock: 45 pcs
$1.34/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TPS22933ARSER specifications
Parameter / AttributeSpecification / Value
TypeSource Selector Switch
FET typeP-Channel
MountingSurface Mount
Supply voltage2.5V ~ 12V
Current - supply2 mA
Output current75mA
Operating temperature-40°C~85°C
PackageTape & Reel (TR); Cut Tape (CT)
ApplicationsHandheld/Mobile Devices
Case8-UFQFN
Delay time - ON65 µs
Delay time - OFF32 µs
Internal switchYes
Ratio - Input:Output3:2

Technical details

Three-input, two-output power mux for portable rail selection

The Texas Instruments TPS22933ARSER is a P-channel source selector switch that routes one of three input supplies to two output rails, with a 3:2 input-to-output ratio. It is designed for handheld and mobile devices where the system must seamlessly switch between a battery, a USB VBUS, and an external adapter without back-feed between the sources. The internal P-channel FETs eliminate the need for external blocking diodes, reducing BOM count and forward voltage drop. With a supply range from 2.5 V to 12 V, it covers single-cell Li-ion through multi-cell or USB-C PD rails.

75 mA per output — enough for sensor rails and low-power peripherals

Each of the two outputs is rated for a maximum continuous current of 75 mA. This suits the part for power-gating sensor rails, low-power MCU I/O banks, Bluetooth/Wi-Fi module supplies, or audio codec rails — not for main processor or display backlight paths. The turn-on delay is 65 µs and the turn-off delay is 32 µs, which allows the downstream load to settle before the supply is switched. The 2 mA supply current is the quiescent draw of the control logic itself, not the load current.

Industrial temperature grade and 8-UQFN footprint

The 8-UQFN package (1.5 mm × 1.5 mm) requires a fine-pitch layout and a clean solder-paste stencil aperture for the thermal pad.

Active production — no immediate LTB risk

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