TPS22915BYFPR

Texas Instruments

Texas Instruments TPS22915BYFPR, 2 A load switch, 37 mOhm typical Rds(on), 1.05 V to 5.5 V load range, single N-channel high-side output, 4-bump DSBGA package, -40°C to 85°C operation.

Texas Instruments TPS22915BYFPR
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MOQ 5 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TPS22915BYFPR specifications
Parameter / AttributeSpecification / Value
Input typeNon-Inverting
Output typeN-Channel
TypeGeneral Purpose
MountingSurface Mount
Voltage - load1.05V ~ 5.5V
Voltage - supply (Vcc (Vdd))Not Required
Output current2A
I/O channels1
InterfaceOn/Off
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesLoad Discharge, Slew Rate Controlled
Rds on37mOhm
Case4-XFBGA, DSBGA
Output configurationHigh Side
Ratio - Input:Output1:1

Technical details

The TPS22915BYFPR is a single-channel, high-side N-channel load switch from Texas Instruments, rated for 2 A continuous output and a load voltage range of 1.05 V to 5.5 V. The 37 mOhm typical on-resistance sets the conduction loss: at 2 A, expect roughly 74 mV drop and 148 mW dissipation inside the package — manageable for the 4-DSBGA if the PCB copper carries the heat. The part includes load discharge and slew-rate control, which limits inrush current when the switch turns on and pulls the output to ground when off — useful for sequencing FPGA core rails or sensor supplies where a floating output could cause latch-up.

The load voltage spans 1.05 V to 5.5 V, covering 1.2 V, 1.8 V, 2.5 V, 3.3 V, and 5 V rails from a single device. The switch does not require a separate Vcc/Vdd supply; it is self-powered from the load input, simplifying the BOM by one rail.

Package and footprint — DSBGA placement reality

The 4-XFBGA, DSBGA package with a 4-bump array uses a 0.5 mm pitch typical for this family. The small bump diameter and tight pitch mean the stencil aperture and solder-paste volume must be controlled to avoid bridging or head-in-pillow defects.

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