TPS22913BYZVT

Texas Instruments

Texas Instruments TPS22913BYZVT, single-channel P-channel load switch, 60 mOhm typical on-resistance, 1.4 V to 5.5 V input, 2 A continuous output, 4-DSBGA (0.88x0.88 mm) package.

Texas Instruments TPS22913BYZVT
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[IN STOCK] In Stock: 53 pcs
$1.10/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TPS22913BYZVT specifications
Parameter / AttributeSpecification / Value
Input typeNon-Inverting
Output typeP-Channel
TypeGeneral Purpose
MountingSurface Mount
Voltage - load1.4V ~ 5.5V
Voltage - supply (Vcc (Vdd))Not Required
Output current2A
I/O channels1
InterfaceOn/Off
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesLoad Discharge, Slew Rate Controlled
Rds on60mOhm
Case4-XFBGA, DSBGA
Fault protectionReverse Current, UVLO
Output configurationHigh Side
Ratio - Input:Output1:1

Technical details

Load switch with integrated reverse-current block

The TPS22913BYZVT is a single-channel high-side P-channel load switch from Texas Instruments, designed for general-purpose power rail switching. The typical 60 mOhm Rds(on) means at 2 A continuous output the conduction loss sits around 240 mW — the 4-DSBGA package relies on the PCB copper for thermal dissipation, so the pad layout under the device directly sets the junction temperature.

Built-in protection and controlled turn-on

The switch includes reverse-current protection and undervoltage lockout (UVLO) — if the output voltage exceeds the input, the internal FET blocks backflow, which saves an external Schottky in battery-powered designs. The slew-rate controlled turn-on limits inrush current into capacitive loads; the On/Off interface is non-inverting, so a logic-high on the enable pin turns the switch on. No external Vcc/Vdd supply is needed — the gate drive is derived from the input rail.

Active production — order against BOM

The base product number is TPS22913; the BYZVT suffix denotes the 4-DSBGA package and tape-and-reel / cut-tape delivery. Sourced per RFQ against your BOM quantity — confirm the package dimensions (0.88x0.88 mm) align with your PCB land pattern before committing.

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