TPS2062CDR

Texas Instruments

Texas Instruments TPS2062CDR general-purpose power switch, dual N-channel high-side, 1:2 ratio, 1A max per output, 90mOhm typ Rds(on), 8-SOIC package.

TPS2062CDR
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[IN STOCK] In Stock: 3 pcs
$0.91/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TPS2062CDR specifications
Parameter / AttributeSpecification / Value
Input typeNon-Inverting
Output typeN-Channel
TypeGeneral Purpose
MountingSurface Mount
Voltage - load4.5V ~ 5.5V
Voltage - supply (Vcc (Vdd))Not Required
Output current1A
I/O channels2
InterfaceOn/Off
Operating temperature-40°C ~ 125°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesLoad Discharge, Status Flag
Rds on90mOhm
Case8-SOIC (0.154\", 3.90mm Width)
Fault protectionCurrent Limiting (Fixed), Over Temperature, Reverse Current, UVLO
Output configurationHigh Side
Ratio - Input:Output1:2

Technical details

Dual high-side switch with integrated protection

The TPS2062CDR: The internal N-channel MOSFETs present a typical 90 mOhm on-resistance, keeping conduction losses low in USB hubs, set-top boxes, and other 5 V rail distribution tasks. Each channel is independently controlled via an active-high, non-inverting On/Off logic interface. The 1:2 input-to-output ratio means a single enable signal gates both channels simultaneously — useful for ganged port switching where individual control is not needed.

Protection suite and status feedback

Fault protection covers the common failure modes in a powered bus: fixed current limiting, over-temperature shutdown, reverse-current blocking, and under-voltage lockout (UVLO). When a fault triggers, the open-drain Status Flag pulls low — a pull-up resistor to the host controller's logic rail lets the firmware read the fault condition. The Load Discharge feature pulls the output down when the switch is turned off, preventing the output capacitor from holding a residual voltage that could confuse downstream devices on the next power-up cycle.

No exposed pad means no thermal-paste or stencil alignment worries — just standard SOIC reflow or drag-soldering. The SOIC-8 body's thermal resistance is modest; at 1 A per channel the 90 mOhm Rds(on) dissipates about 90 mW per channel, well within the package's capability without airflow.

TPS2062CDR
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