TPD4E1B06DCKR

Texas Instruments

Texas Instruments TPD4E1B06DCKR Steering (Rail to Rail) TVS diode array, 4 bidirectional channels, 5.5V max reverse standoff, 7V breakdown min, 14.5V typical clamping, 45W peak pulse power, 3A (8/20µs) peak pulse current, SC-70-6 package, -40°C to 125°C operating temperature.

Texas Instruments TPD4E1B06DCKR
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TPD4E1B06DCKR specifications
Parameter / AttributeSpecification / Value
TypeSteering (Rail to Rail)
MountingSurface Mount
Voltage - breakdown7V
Voltage - clamping (Max) @ ipp14.5V (Typ)
Voltage - reverse standoff5.5V (Max)
Current - peak pulse (10/1000μs)3A (8/20µs)
Power - peak pulse45W
Power line protectionNo
Operating temperature-40°C~125°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
ApplicationsGeneral Purpose
Case6-TSSOP, SC-88, SOT-363
Bidirectional channels4

Technical details

Rail-to-rail steering protection for high-speed data lines

The Texas Instruments TPD4E1B06DCKR is a rail-to-rail steering TVS diode array packing four bidirectional channels into a SC-70-6 package. It clamps transients to the supply rails — reverse standoff is 5.5V max, breakdown starts at 7V min, and typical clamping hits 14.5V at the peak pulse current of 3A (8/20µs waveform). The 45W peak pulse power rating covers ESD strikes and small surge events on general-purpose I/O, USB, HDMI, or other differential signal lines where board space is tight.

Clamping voltage and peak pulse current — what they mean for signal integrity

With a typical clamping voltage of 14.5V at 3A, this device keeps the protected line from seeing a hard rail-to-rail swing during a transient. The 5.5V max reverse standoff means the array sits transparently on a 3.3V or 5V supply rail without leaking appreciably. The 7V minimum breakdown gives a guard band so the part doesn't start conducting during normal signal peaks.

Package and footprint — SC-70-6 (SOT-363)

The TPD4E1B06DCKR comes in a 6-lead SC-70-6 (also known as SOT-363) surface-mount package. The small footprint — roughly 2.0 mm x 1.25 mm — makes it suitable for dense PCB layouts where every square millimetre counts. The supplier device package is SC-70-6, which is the TI-specific variant of the SOT-363 outline. Mounting is surface mount only.

TPD4E1B06DCKR
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