USB-C port protection in a 9-ball package
The Texas Instruments TPD2S300YFFR is a USB Type-C protection IC built around an internal switch architecture. It integrates four protection circuits into a single 9-DSBGA package, sized for space-constrained USB-C port applications where board area is tight and the connector footprint leaves little room for discrete protection components.
What the four-circuit count means for your BOM
Four internal switch circuits handle the CC1, CC2, SBU1, and SBU2 lines typical in a USB-C receptacle. Each circuit disconnects the protected node during overvoltage or short-circuit events.
DSBGA footprint — layout and rework considerations
The 9-DSBGA package is a fine-pitch, no-lead array. It requires a solder-paste stencil with apertures matched to the ball diameter and a reflow profile following the JEDEC standard for that body size.
For procurement, this eliminates the obsolescence risk that haunts older USB-C protection parts.