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Texas Instruments TPA721DGN — Analog & Data Acquisition

TPA721DGN Class AB Audio Amp, 700mW into 8Ω, 8-MSOP

MPNTPA721DGN
End of Life

Texas Instruments TPA721DGN, Class AB mono audio amplifier, 700mW into 8Ω, 2.5V-5.5V supply, -40°C to 85°C, 8-HVSSOP package, Tube.

$1.83Ref. price · indicative, final on quote
Texas Instruments TPA721DGN datasheet (PDF)
Packaging8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TPA721DGN specifications
ParameterValue
TypeClass AB
Output type1-Channel (Mono)
MountingSurface Mount
Supply voltage2.5V ~ 5.5V
Max output power x channels @ load700mW x 1 @ 8Ohm
Operating temperature-40°C ~ 85°C (TA)
PackageTube
FeaturesDepop, Short-Circuit and Thermal Protection, Shutdown
Case8-TSSOP, 8-MSOP (0.118\", 3.00mm Width) Exposed Pad

Product details

The Texas Instruments TPA721DGN is a Class AB mono audio amplifier rated for 700 mW into an 8 Ω load. The package is an 8-pin HVSSOP with an exposed pad.

700 mW into 8 Ω is a headphone-amp level, not a speaker-amp level. It'll drive a small speaker for beeps and voice prompts.

Protection features — shutdown, short-circuit, thermal

Built-in shutdown pin lets a microcontroller kill the amp when idle, saving battery draw. Short-circuit and thermal protection keep it from self-destructing if the output gets grounded or the board gets hot. Depop circuitry suppresses the turn-on thump that would otherwise hit the speaker.

Frequently asked questions

Where can I buy TPA721DGN?

Sourced and quoted to order through our independent distribution channel. Submit an RFQ for current availability and pricing — confirmed at quote time.

What is the output power of TPA721DGN at 8 ohms?

700 mW per channel into an 8 Ω load. That's the rated maximum output power for the mono channel.

Does TPA721DGN require a heatsink?

No external heatsink is needed if the PCB layout provides a solid thermal path through the exposed pad on the HVSSOP package. The pad is the primary heat-dissipation path.

What is the closest pin-compatible alternative to TPA721DGN?

The TPA721DGN is part of TI's TPA721 family. The TPA721DGN is the industrial-temperature, HVSSOP-packaged variant. The standard TPA721 (without the 'DGN' suffix) is in a different package (SOIC or MSOP without exposed pad). For a direct pin-compatible drop-in, stick with the TPA721DGN — the exposed pad footprint is specific to the DGN package code.