Package and board-fit — 8-HVSSOP with exposed pad
The TPA6110A2DGN comes in an 8-HVSSOP package (3.00 mm width, exposed pad) — the pad underneath needs a thermal land on the PCB and a via array to the ground plane to keep the die temperature under 85°C at full output. The 8-pin MSOP footprint is standard; the exposed pad adds a soldering step that reflow handles fine but hand-soldering on site is trickier without a hot-air station.
Output power and load — 150 mW per channel into 16 ohms
Rated 150 mW per channel into 16 ohms — that is enough to drive most consumer and pro-audio headphones to comfortable listening levels without a separate headphone amp. The Class AB output stage keeps crossover distortion low, which matters for low-level signals where a Class D amp might add audible artifacts.
Built-in depop circuitry suppresses turn-on/turn-off clicks, and short-circuit and thermal protection keep the part from failing if the headphone jack gets yanked or the output is shorted.
Active lifecycle — still in production
ROHS3 compliant.