Skip to main content
Texas Instruments TPA2018D1YZFT — Analog & Data Acquisition

TPA2018D1YZFT Texas Instruments Class D Amp, 3W Mono

MPNTPA2018D1YZFT
End of Life

Texas Instruments SmartGain™ Class D audio amplifier, TPA2018D1YZFT, mono 3W into 4Ω, I²C volume control, 2.5V-5.5V supply, 9-DSBGA package, active production.

$2.8Ref. price · indicative, final on quote
Packaging9-UFBGA, DSBGA
RoHSROHS3 Compliant
SeriesSmartGain™
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TPA2018D1YZFT specifications
ParameterValue
TypeClass D
SeriesSmartGain™
Output type1-Channel (Mono)
MountingSurface Mount
Supply voltage2.5V ~ 5.5V
Max output power x channels @ load3W x 1 @ 4Ohm
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesDifferential Inputs, I²C, Short-Circuit and Thermal Protection, Shutdown, Volume Control
Case9-UFBGA, DSBGA

Product details

3W into 4Ω — what the output rating means for the load

The TPA2018D1YZFT: The 3W x 1 @ 4Ω figure is the maximum continuous output power per channel into a 4-ohm speaker load. In a portable design with a 3.7V Li-ion cell, the available output drops as the battery discharges toward 2.5V — the amplifier's supply range covers the full discharge curve, but the headroom for peak SPL narrows below 3.0V. The I²C interface controls gain, volume, and shutdown without external potentiometers or analog switches — the register map sets the gain in 0.5 dB steps from -28 dB to +30 dB, which lets the system processor tune the speaker level per application without changing BOM resistors. Differential inputs reject common-mode noise from the audio source — useful when the amplifier sits on a separate PCB from the codec or when the ground plane carries switching noise from a DC-DC converter.

9-DSBGA — package, reflow, and board integration

The 9-DSBGA package (0.5 mm pitch, 0.9 x 1.3 mm body) has no exposed thermal pad — all heat dissipates through the solder balls into the PCB copper. Surface-mount assembly with a standard lead-free reflow profile works — the package is MSL1 per TI's standard DSBGA qualification, so no pre-bake is required if the reel is unsealed less than 168 hours before reflow.

Frequently asked questions

What is the closest pin-compatible alternative to the TPA2018D1YZFT?

The TPA2018D1 is a unique TI SmartGain device; a functional replacement would require a board respin if the package or pinout differs.