Class D stereo amp — 2 W per channel into 4 Ω
The TPA2000D4DAPRG4: That 2 W x 2 figure is the headline — enough for a pair of small speakers in a portable or desktop audio system, where the Class D topology keeps heat dissipation low enough that the 32-TSSOP exposed-pad package can run without a heatsink in still air. The output stage is 2-channel stereo with a separate stereo headphone output, so a single IC drives both the main speakers and the headphone jack — no extra headphone amp chip on the BOM.
Industrial temp grade and exposed-pad package
The 32-HTSSOP package has an exposed thermal pad on the bottom; the board layout needs a matching copper land and vias to the ground plane to pull heat out of the die. Without that thermal via pattern, the output current derates sooner. Surface-mount only — no socketed or through-hole variant. The 0.240-inch body width (6.10 mm) is a standard TSSOP footprint; the exposed pad adds one extra PCB step (solder paste under the pad) but is well documented in TI application notes.
Because it is an active, current-generation part, sourcing runs through the standard TI distribution channel.