±1°C accuracy in a 4-bump DSBGA
The TMP144YFFT: That ±1°C window is the spec that matters for most designs — it means the sensor can serve as the primary thermal monitor in a battery pack or portable device without needing a calibration step on the production line.
4-DSBGA footprint and board-fit
The 4-DSBGA is tiny — roughly 0.8 mm × 0.8 mm — so the board area cost is near zero, but the fine-pitch BGA demands a controlled solder-paste stencil and X-ray inspection on the first build. The surface-mount assembly is standard reflow; no special underfill is required for most portable applications. Operating temperature is -40°C to 125°C with the sensor tested at -10°C to 100°C and -40°C to 125°C conditions.
Active lifecycle and compliance
Texas Instruments lists no pin-compatible second source or direct successor for this order code. If you are evaluating a BOM hedge, the SMAART Wire protocol is TI-proprietary, so a drop-in alternate from another vendor is unlikely — the design is locked to this interface unless you add a protocol translator.