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Texas Instruments TM4C129ENCZADI3R — Microcontrollers & Processors (MCU / MPU / DSP)

TI TM4C129ENCZADI3R Tiva C MCU, ARM Cortex-M4F 120MHz

MPNTM4C129ENCZADI3R
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Texas Instruments Tiva C series TM4C129ENCZADI3R, 32-bit ARM Cortex-M4F MCU, 120MHz, 1MB Flash, 256K x 8 RAM, 6K x 8 EEPROM, 140 I/O, Ethernet, USB OTG, CAN, 24x12b ADC, 212-NFBGA (10x10), -40°C to 85°C.

$13.8277Ref. price · indicative, final on quote
Texas Instruments TM4C129ENCZADI3R datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

TM4C129ENCZADI3R specifications
ParameterValue
SeriesTiva™ C
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.97V ~ 3.63V
Operating temperature-40°C~85°C(TA)
Speed120MHz
PackageTape & Reel (TR)
RAM size256K x 8
Core size32-Bit Single-Core
EEPROM size6K x 8
PeripheralsBrown-out Detect/Reset, DMA, Motion Control PWM, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, QEI, SPI, SSI, UART/USART, USB OTG
Number of i (O)140
Core processorARM® Cortex®-M4F
Case212-VFBGA
Data convertersA/D 24x12b
Program memory size1MB (1M x 8)

Product details

It has 1 MB Flash and 256K x 8 SRAM.

120 MHz Cortex-M4F — what it buys you

The 120 MHz core with an FPU lets you close a current-control loop at several kilohertz and still have headroom for Ethernet packet handling. The 24-channel 12-bit ADC samples synchronously with the PWM timers — useful for three-phase motor current sensing without software jitter.

Connectivity and I/O budget

The USB OTG port can act as a device for firmware updates or as a host for a USB flash drive logging data.

The 212-NFBGA (10x10) package is a fine-pitch BGA. Expect four-layer minimum PCB with via-in-pad or microvia for the center balls.

Frequently asked questions

What is the speed rating of TM4C129ENCZADI3R?

The core runs at 120 MHz, which is the maximum clock for the ARM Cortex-M4F on this device.

What package does TM4C129ENCZADI3R come in?

It is supplied in a 212-ball NFBGA (10x10 mm) package, surface-mount only.