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Texas Instruments TM4C129DNCPDTT3R — Microcontrollers & Processors (MCU / MPU / DSP)

TM4C129DNCPDTT3R Tiva C ARM Cortex-M4F MCU, 120 MHz

MPNTM4C129DNCPDTT3R
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Texas Instruments Tiva™ C Series TM4C129DNCPDTT3R, 32-bit ARM Cortex-M4F MCU, 120 MHz, 1 MB Flash, 256 KB RAM, 6 KB EEPROM, 90 I/O, Ethernet + CAN + USB OTG, 128-TQFP, -40°C to 105°C.

$12.9276Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

TM4C129DNCPDTT3R specifications
ParameterValue
SeriesTiva™ C
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.97V ~ 3.63V
Operating temperature-40°C~105°C(TA)
Speed120MHz
PackageTape & Reel (TR)
RAM size256K x 8
Core size32-Bit Single-Core
EEPROM size6K x 8
PeripheralsBrown-out Detect/Reset, DMA, Motion Control PWM, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, QEI, SPI, SSI, UART/USART, USB OTG
Number of i (O)90
Core processorARM® Cortex®-M4F
Case128-TQFP
Data convertersA/D 20x12b
Program memory size1MB (1M x 8)

Product details

120 MHz Cortex-M4F with integrated Ethernet and CAN — what it means for a connected-control BOM

It carries 1 MB of program Flash and 256 KB of SRAM, plus 6 KB of EEPROM for configuration parameters that survive a power cycle. The part is built for industrial and infrastructure edge nodes that need a real-time control core and multiple wired fieldbuses on a single die — Ethernet MAC+PHY, two CAN 2.0B controllers, and USB OTG are all on-chip, so a gateway design avoids an external PHY or CAN transceiver on the MCU side.

Peripheral set for a single-chip gateway

Beyond Ethernet and CAN, the connectivity list includes SSI (synchronous serial), I²C, UART/USART with IrDA, and a QEI for quadrature encoder decoding. The 20-channel 12-bit ADC samples at rates suitable for current-sense feedback in a motion-control PWM loop. Brown-out detect and POR are integrated, so an external supervisor is optional for cost-sensitive builds.

Housed in a 128-TQFP with a 14x14 mm body and 0.4 mm pitch, the package is hand-solderable in rework and compatible with standard QFP sockets for prototyping. The exposed pad (thermal pad) needs a via-stitched ground plane on the top layer to pull heat out; without it, continuous 120 MHz operation at 105°C ambient pushes the junction toward the limit.

Frequently asked questions

What is the difference between TM4C129DNCPDTT3R and TM4C129ENCZADT3?

Both are Tiva C Series Cortex-M4F MCUs with the same core architecture and peripheral set. The TM4C129DNCPDTT3R is in a 128-TQFP package with 90 I/O; the TM4C129ENCZADT3 uses a 212-BGA package with additional I/O and a different pinout. The BGA variant is chosen when board area is tight and the extra I/O count is needed, but the TQFP version is easier to route, inspect, and rework in prototype and mid-volume production.

Does TM4C129DNCPDTT3R have a direct pin-compatible replacement?

Within the Tiva C TM4C129 family, several density and temperature-grade variants share the same 128-TQFP footprint. The base product number TM4C129 covers a range of Flash and RAM options that are pin-compatible across the package. No single direct-replacement order code is listed as an official cross-reference, but the family's pin compatibility allows a BOM swap between Flash/RAM tiers without a board respin.