Texas Instruments TLV9002SIDGSR, dual general-purpose op-amp, 1 MHz gain bandwidth, 2 V/µs slew rate, rail-to-rail output, 60 µA supply per channel, 1.8 V to 5.5 V supply, -40°C to 125°C, 10-VSSOP package.
| Parameter | Value |
|---|---|
| Output type | Rail-to-Rail |
| Mounting | Surface Mount |
| Amplifier type | General Purpose |
| Voltage - input offset | 400 µV |
| Voltage - supply span | 5.5 V |
| Current - supply | 60µA |
| Current - input bias | 5 pA |
| Current - output (Channel) | 40 mA |
| Operating temperature | -40°C~125°C(TA) |
| Gain bandwidth product | 1 MHz |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Slew rate | 2V/µs |
| Case | 10-TFSOP, 10-MSOP (0.118\", 3.00mm Width) |
| Number of circuits | 2 |
The TLV9002SIDGSR: The 1 MHz gain-bandwidth product and 2 V/µs slew rate handle sensor conditioning, signal buffering, and low-frequency filtering without excess loop gain.
Each amplifier draws 60 µA typical supply current. The 5 pA input bias current and 400 µV input offset voltage are typical for this class.
The 10-VSSOP package (3.00 mm × 3.00 mm body) is a common footprint for space-constrained PCBs.
Designers need to ensure compatibility with their power rails.
Rail-to-rail output is critical for low-voltage applications to maximize dynamic range.
Buyers need to know cost and availability for procurement decisions.
Engineers often look for drop-in replacements to manage supply chain or performance upgrades.
Sourcing buyers need to find distributors with inventory to meet BOM requirements.
Hardware designers need correct pin mapping for PCB layout.