Texas Instruments TLV9002IDGKT dual general-purpose op-amp, 1 MHz gain-bandwidth, rail-to-rail output, 60 µA supply per channel, 1.8 V to 5.5 V supply, -40°C to 125°C, 8-VSSOP package.
| Parameter | Value |
|---|---|
| Output type | Rail-to-Rail |
| Mounting | Surface Mount |
| Amplifier type | General Purpose |
| Voltage - input offset | 400 µV |
| Voltage - supply span | 5.5 V |
| Current - supply | 60µA |
| Current - input bias | 5 pA |
| Current - output (Channel) | 40 mA |
| Operating temperature | -40°C~125°C(TA) |
| Gain bandwidth product | 1 MHz |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Slew rate | 2V/µs |
| Case | 8-TSSOP, 8-MSOP (0.118\", 3.00mm Width) |
| Number of circuits | 2 |
Each amplifier draws 60 µA typical supply current, making the pair fit into always-on sensor interfaces or battery-powered loops where every microamp is budgeted.
Housed in an 8-VSSOP (3.00 mm × 3.00 mm) package, the TLV9002IDGKT is a surface-mount device suited for dense PCB layouts where board area is tight. The 8-VSSOP footprint is shared with many standard dual op-amps, easing second-sourcing if a design needs to qualify an alternate supplier later.
Design engineers need to verify specifications and pinout before integrating into circuits.
Sourcing buyers need confirmed inventory to fill BOM lines without delays.
Buyers need cost estimates for budget planning and comparison.
Engineers may need drop-in alternatives for availability or performance reasons.
Rail-to-rail is critical for low-voltage applications; engineers need exact input/output ranges.
Common design question to ensure part operates within desired voltage range.