TLV5631IPW

Texas Instruments

Texas Instruments TLV5631IPW, 8-channel 10-bit voltage-output DAC, string DAC architecture, 7µs settling time, SPI interface, 20-TSSOP package, -40°C to 85°C.

Texas Instruments TLV5631IPW
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[IN STOCK] In Stock: 6 pcs
$24.10/ pc

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Technical specifications

TLV5631IPW specifications
Parameter / AttributeSpecification / Value
Output typeVoltage - Buffered
MountingSurface Mount
Reference typeExternal, Internal
Voltage - supply, analog2.7V ~ 3.3V, 5V
Voltage - supply, digital2.7V ~ 3.3V, 5V
Data interfaceSPI
Operating temperature-40°C ~ 85°C
PackageTube
ArchitectureString DAC
INL (DNL)±0.5, ±0.1
Settling time7µs
Number of bits10
Case20-TSSOP (0.173\", 4.40mm Width)
Differential outputNo
Number of d (A converters)8

Technical details

Eight channels, 10 bits, one small package

The TLV5631IPW packs eight 10-bit DACs with voltage-buffered outputs into a 20-TSSOP — a channel density that saves board space in multi-loop control or waveform-generation applications where each output needs its own analog voltage. Settling to 0.5 LSB in 7 µs means the part can update all eight channels sequentially at roughly 140 kHz per channel, fast enough for servo-valve control, programmable power supplies, or audio-level setting without a dedicated fast-DAC bank.

Linearity and monotonicity for closed-loop systems

Integral nonlinearity of ±0.5 LSB and differential nonlinearity of ±0.1 LSB guarantee monotonic behavior — the output never decreases for an increasing digital code, a requirement in feedback loops where a non-monotonic step would cause oscillation or hunting. The string DAC architecture is inherently monotonic, and the tight DNL means the transfer function has no missing codes across the full 10-bit range — a calibration technician can trust the output step size without per-unit trimming.

Supply rails and interface fit

The SPI data interface uses standard 3- or 4-wire signaling and operates at clock rates up to 20 MHz (typical), so it connects directly to most MCU SPI peripherals without level shifters or glue logic at 3.3 V.

Temperature range and package for industrial boards

The 20-TSSOP body measures 6.5 mm × 4.4 mm with a 0.65 mm pin pitch — a footprint that routes easily on a two-layer board and leaves room for bypass capacitors and output filtering near each channel.

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