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Texas Instruments TLV4112IDGN — Microcontrollers & Processors (MCU / MPU / DSP)

TI TLV4112IDGN Dual Op-Amp, 2.7 MHz, 320 mA Output, 8-HVSSOP

MPNTLV4112IDGN
End of Life

Texas Instruments TLV4112IDGN dual general-purpose op-amp, 2.7 MHz gain-bandwidth, 320 mA output per channel, rail-to-rail, 8-HVSSOP exposed-pad package, tube.

$3.33Ref. price · indicative, final on quote
Packaging8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TLV4112IDGN specifications
ParameterValue
Output typeRail-to-Rail
MountingSurface Mount
Amplifier typeGeneral Purpose
Voltage - input offset175 µV
Voltage - supply span2.5 V
Current - supply700µA (x2 Channels)
Current - input bias0.3 pA
Current - output (Channel)320 mA
Operating temperature-40°C ~ 125°C
Gain bandwidth product2.7 MHz
PackageTube
Slew rate1.57V/µs
Case8-TSSOP, 8-MSOP (0.118\", 3.00mm Width) Exposed Pad
Number of circuits2

Product details

Dual op-amp with 320 mA output drive

The TLV4112IDGN is a dual-channel general-purpose op-amp from Texas Instruments, delivering a gain-bandwidth product of 2.7 MHz and a per-channel output current of 320 mA — enough to drive headphones, small relays, or the input stage of a downstream power amplifier without a separate buffer. Each channel draws 700 µA supply current (both channels active), keeping the total quiescent draw under 1.4 mA — relevant for battery-powered or multi-channel signal-conditioning boards where the op-amp budget shares a rail with the ADC or sensor bias.

Supply rails and analog performance

Rail-to-rail output swing lets the signal reach the supply rails, preserving dynamic range in low-voltage single-supply chains. Input bias current is 0.3 pA typical, so high-impedance sources (pH probes, photodiode front-ends) see negligible loading. Input offset voltage is 175 µV typical, which sets the DC accuracy floor for precision applications.

Package and thermal interface

Housed in an 8-HVSSOP with an exposed pad (the 8-TSSOP/MSOP footprint with 0.118-inch body width). Surface-mount only; the tube packaging means the parts ship in anti-static tubes, not tape-and-reel — factor this into pick-and-place feeder setup if the line is set up for reels.

An engine-bay sensor interface or an outdoor PLC analog input module that sees 105°C on a hot day still has margin before the die hits the upper limit.