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Texas Instruments TLV4031R2YKAR — Analog & Data Acquisition

TLV4031R2YKAR Texas Instruments Comparator, 1.6-5.5V

MPNTLV4031R2YKAR
End of Life

Texas Instruments TLV4031R2YKAR general-purpose comparator with fixed reference, 1.6-5.5V supply, 20mV hysteresis, open-drain rail-to-rail output, 4-DSBGA package, -40°C to 125°C.

$1.2Ref. price · indicative, final on quote
Packaging4-XFBGA, DSBGA
RoHSROHS3 Compliant
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TLV4031R2YKAR specifications
ParameterValue
TypeGeneral Purpose
Output typeOpen-Drain, Rail-to-Rail
MountingSurface Mount
Voltage - supply, single (Dual (±))1.6V ~ 5.5V
Output current55mA @ 5V
Current - quiescent3.5µA
Current - input bias10pA @ 5V
Operating temperature-40°C ~ 125°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
Hysteresis20mV
Case4-XFBGA, DSBGA
Number of elements1
Propagation delay360ns

Product details

Fixed-reference comparator for threshold monitoring

The TLV4031R2YKAR is a Texas Instruments general-purpose comparator with an integrated fixed reference — it compares an external signal against a preset threshold without needing an external voltage reference or resistor divider. The 20 mV hysteresis built into the comparator cleans up noisy input edges, preventing output chatter near the trip point.

Quiescent current and response time

Maximum quiescent current is 3.5 µA, which keeps the power budget tight for always-on sensor monitors or wake-up circuits. Input bias current is 10 pA max at 5 V, so the comparator does not load high-impedance signal sources. Propagation delay is 360 ns max — fast enough for overcurrent or undervoltage detection in moderate-speed control loops, but not intended for GHz-level switching. The output can sink 55 mA at 5 V, enough to drive a small relay coil or an LED indicator directly.

Package and temperature grade

Housed in a 4-bump DSBGA (4-XFBGA) package, the TLV4031R2YKAR occupies minimal board area — the 4-DSBGA supplier device package is a 0.8 mm × 0.8 mm footprint typical for wafer-level chip-scale packages. Surface-mount assembly requires a solder-paste stencil with small apertures; the tiny pitch demands careful PCB layout and reflow profile control.