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Texas Instruments TLV320DAC3203IRGET — Memory (DRAM / SRAM / Flash / EEPROM)

TLV320DAC3203IRGET Class AB Stereo Headphone Amp, 24-VQFN

MPNTLV320DAC3203IRGET
End of Life

Texas Instruments PowerTune™ TLV320DAC3203IRGET, Class AB stereo headphone amplifier, 2-channel (stereo) output, I²S/I²C/SPI digital interface, 1.5V–1.95V supply, -40°C to 85°C, 24-VFQFN Exposed Pad (24-VQFN 4x4 mm).

$2.27Ref. price · indicative, final on quote
Packaging24-VFQFN Exposed Pad
StockContact for availability
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Specifications

TLV320DAC3203IRGET Technical Specifications
ParameterValue
TypeClass AB
SeriesPowerTune™
Output typeHeadphones, 2-Channel (Stereo)
Mounting typeSurface Mount
Voltage1.5V ~ 1.95V
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesDepop, I²C, I²S, Microphone, Mute, SPI, Volume Control
Case24-VFQFN Exposed Pad

Product details

What this part is and what it does

The Texas Instruments TLV320DAC3203IRGET is a Class AB stereo headphone amplifier with an integrated digital audio interface. It accepts I²S audio data and control via I²C or SPI, and drives a 2-channel (stereo) headphone output directly. The part includes depop circuitry to suppress turn-on clicks, a mute function, and microphone input support — making it a self-contained audio codec for portable or embedded systems that need line-level or headphone drive.

Digital audio interfaces — I²S and control buses

The TLV320DAC3203IRGET communicates audio data over I²S and configuration over I²C or SPI. That means it fits directly behind any MCU or DSP with a standard I²S peripheral — no glue logic needed. The I²S clock and word-select lines determine the sample rate; the control bus sets volume, mute, and depop timing. If your host already has an I²C port, you save two GPIOs versus SPI.

Frequently asked questions

Does TLV320DAC3203IRGET support I²S?

Yes. The part includes an I²S audio data interface alongside I²C and SPI control buses.

What is the TLV320DAC3203IRGET pinout?

The pinout is defined in the TI datasheet for the 24-VQFN (4x4 mm) package. The exposed pad is the thermal and ground pad. Digital audio (I²S) and control (I²C/SPI) pins are grouped on one side; analog headphone outputs on the opposite side. Refer to the official datasheet for the full pin map.