TLV274IPWR

Texas Instruments

Texas Instruments TLV274IPWR quad general-purpose op-amp, 3 MHz gain bandwidth, 2.6 V/µs slew rate, rail-to-rail output, 14-TSSOP package, surface mount.

Texas Instruments TLV274IPWR
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[IN STOCK] In Stock: 2,742 pcs
$1.29/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TLV274IPWR specifications
Parameter / AttributeSpecification / Value
Output typeRail-to-Rail
MountingSurface Mount
Amplifier typeGeneral Purpose
Voltage - input offset500 µV
Voltage - supply span2.7 V
Current - supply550µA (x4 Channels)
Current - input bias1 pA
Current - output (Channel)8 mA
Operating temperature-40°C ~ 125°C
Gain bandwidth product3 MHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate2.6V/µs
Case14-TSSOP (0.173\", 4.40mm Width)
Number of circuits4

Technical details

Active production — what it means for your BOM

The TLV274IPWR is listed as Active by Texas Instruments, so it remains a current-production part suitable for new designs and ongoing production. ROHS3 compliant — the part meets the latest EU restriction-of-hazardous-substances directive, which simplifies compliance documentation for finished goods sold into the European market.

Parametric fit for signal-conditioning chains

Four general-purpose op-amps in one 14-TSSOP package, each channel drawing 550 µA from a 2.7 V to 16 V supply span. The 3 MHz gain-bandwidth product and 2.6 V/µs slew rate handle audio-band filtering and moderate-speed sensor amplification without excess power draw. Rail-to-rail output swing means the signal can reach within millivolts of each supply rail — useful when the ADC reference is close to the supply, or when driving a single-supply input without losing headroom. Input bias current of 1 pA typ and input offset voltage of 500 µV max keep DC errors low enough for most general-purpose signal conditioning; the 8 mA per-channel output current can drive a modest load or a downstream ADC input directly.

Package and temperature grade — rework and environment

14-TSSOP (4.40 mm wide) is a fine-pitch, low-profile surface-mount package. The 0.65 mm pin pitch and exposed pad (if present — not specified here) mean a standard hot-air rework station with a fine nozzle can lift and replace it cleanly, provided the board is pre-baked if moisture-sensitive. Pin 1 is marked by a dot on the package top, so orientation is clear under magnification. Rated for -40°C to 125°C ambient — industrial temperature grade. This covers outdoor telecom cabinets, engine-bay electronics, and factory-floor control modules where the enclosure sees thermal cycling.

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