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TLV2462AQDRQ1

TLV2462AQDRQ1 Texas Instruments Op Amp, 6.4 MHz, AEC-Q100

MPNTLV2462AQDRQ1
Active

Texas Instruments Automotive, AEC-Q100 series, TLV2462AQDRQ1 dual general-purpose op amp, 6.4 MHz gain-bandwidth, rail-to-rail output, 8-SOIC package.

$3.8700Ref. price · indicative, final on quote
Packaging8-SOIC (0.154", 3.90mm Width)
RoHSROHS3 Compliant
SeriesAutomotive, AEC-Q100
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TLV2462AQDRQ1 specifications
ParameterValue
SeriesAutomotive, AEC-Q100
Output typeRail-to-Rail
MountingSurface Mount
Amplifier typeGeneral Purpose
Voltage - input offset150 µV
Voltage - supply span2.7 V
Current - supply550µA (x2 Channels)
Current - input bias1.3 nA
Current - output (Channel)80 mA
Operating temperature-40°C~125°C
Gain bandwidth product6.4 MHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate1.6V/µs
Case8-SOIC (0.154\", 3.90mm Width)
Number of circuits2

Product details

Active production — BOM-fit for automotive signal chains

The TLV2462AQDRQ1 is an active-production dual general-purpose op amp from Texas Instruments, qualified to AEC-Q100 Grade 1 for automotive applications. With a 6.4 MHz gain-bandwidth product and 1.6 V/µs slew rate, this part handles audio-band filtering, sensor conditioning, and actuator drive loops without running out of steam.

Dual-channel power budget — 550 µA per amplifier

Each of the two channels draws 550 µA supply current, so the full device consumes 1.1 mA quiescent. For a battery-powered ECU logging sensor data, that's a reasonable trade-off between bandwidth and battery life — the 80 mA output drive per channel can also directly energize a small relay or indicator LED without a separate buffer. These numbers mean the part won't introduce significant DC error in a high-impedance sensor front-end — a 10 kΩ source sees less than 13 µV of voltage drop from bias current alone.

8-SOIC footprint — hand-solderable, board-friendly

The 8-SOIC package (0.154" body width, 3.90 mm) is a standard footprint that rework techs can hand-solder with a fine-tip iron. The supplier device package is 8-SOIC, same as the package/case, so the PCB land pattern is unambiguous.