The TLE2021CP: It delivers a 2 MHz gain-bandwidth product and a 0.65 V/µs slew rate, drawing only 240 µA of supply current.
The 2 MHz gain-bandwidth product sets the usable small-signal frequency range: at a closed-loop gain of 10, the -3 dB bandwidth is about 200 kHz. The 0.65 V/µs slew rate limits full-scale output swing to roughly 100 kHz at 2 Vpp output. These are modest numbers by today's standards — the part is not intended for high-speed data acquisition or video processing. It fits signal conditioning loops in the audio band, sensor buffering, and control-loop compensation where the signal content stays below 100 kHz.
The through-hole DIP package also means no MSL bake concerns before hand-assembly or rework — the part is moisture-insensitive by nature of the leaded package construction.
Through-hole DIP — prototyping and low-volume production fit
The 8-DIP (0.300", 7.62 mm) package with through-hole mounting is a deliberate choice for benchtop prototyping, breadboard compatibility, and hand-soldered assemblies. The 8-PDIP supplier package designation confirms the standard 0.100" pin pitch and 0.300" row spacing. If the production volume scales and a surface-mount footprint is preferred, the TLE2021CP has no direct SMD sibling in the Excalibur family — a board redesign to a modern SMD op-amp like the TLV9351IDCKR would be required. For now, the DIP format keeps assembly simple and inspection easy, especially in repair and rework scenarios.
As an active TI part in a through-hole package, the TLE2021CP is available through the independent distribution channel. The through-hole format means the part ships in tubes (the listed package type is Tube), not tape-and-reel — expect tube quantities of 50 or 100 depending on the distributor's break-pack policy. Lead times for active through-hole parts from major manufacturers typically run 8 to 16 weeks from factory order, but independent stock may offer shorter windows. The ROHS3 compliance is current, so no Pb-free transition concerns for new builds.