Die-level 555 timer for hybrid and multi-chip modules
The TLC555TDF2 is a single 555-type timer/oscillator from Texas Instruments' LinCMOS™ series, supplied as a bare die for direct wire-bond integration into hybrid circuits, multi-chip modules (MCMs), or chip-on-board (COB) assemblies. It oscillates up to 2.1 MHz and draws only 360 µA typical supply current at 5 V — the CMOS construction keeps quiescent loss an order of magnitude below the bipolar NE555, which matters when the die shares a substrate with low-power logic or sensor front-ends. The 2 V to 15 V supply range covers single-cell Li-ion through 12 V rails, so the same die can serve portable, automotive, or industrial bias domains without a separate regulator.
Active lifecycle and compliance posture
Because this is a bare die, standard JEDEC moisture-sensitivity level (MSL) ratings for packaged ICs do not apply; handling follows TI's die-level storage and bake guidelines.
Die form-factor and integration checklist
Supplied as an unsawn die on a film-frame carrier (Tube packaging per), the TLC555TDF2 requires a pick-and-place tool with die ejection and a wire bonder capable of the pad pitch. No lead frame or molded body — the die backside is typically epoxy-attached to the substrate and wire-bonded to the landing pads. The 2.1 MHz oscillation frequency sets the timing resistor-capacitor (RC) network values; at 360 µA supply, the timing capacitor charging current is well below the bipolar 555's 10 mA peak, so the RC time constant is less affected by supply ripple. Decouple the supply rail with a 0.1 µF ceramic die-attached as close to the bond pads as the substrate layout allows — the CMOS output edges at 2.1 MHz can couple noise into adjacent traces if the bypass loop is long.