Die-form 555 timer for hybrid integration
The TLC555TDF1 is a single 555-type timer/oscillator from TI's LinCMOS™ series, delivered as a bare die for direct wire-bond integration into hybrid circuits or multi-chip modules. It oscillates up to 2.1 MHz and draws just 360 µA typical supply current across a 2 V to 15 V rail — the CMOS construction keeps the quiescent draw low enough for battery-backed timer functions where a bipolar 555 would drain the cell.
What the die package means for your assembly
This is a bare semiconductor die, not a packaged IC — there is no leadframe, no mould compound, and no package outline. The die attaches directly to a substrate or hybrid circuit board with conductive epoxy or solder preform, and the bond pads connect via wire bonds to the circuit traces. Because there is no package, the thermal path is direct: the die backside (typically grounded) bonds to the substrate pad, and the junction-to-substrate thermal resistance is set by the bond-line thickness and the substrate's copper spreader. Plan the die-attach cure profile and wire-bond loop height before the first prototype run.
For a die-form component, the compliance declaration covers the semiconductor itself; the final assembly's RoHS status depends on the die-attach and encapsulation materials used in the hybrid build.