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Texas Instruments TLC555CP — Clock & Timing ICs

Texas Instruments TLC555CP 555 Timer, 2.1MHz, 8-DIP

MPNTLC555CP
End of Life

Texas Instruments LinCMOS™ 555 Type, Timer/Oscillator (Single), TLC555CP, 2.1MHz, 360µA, 2V-15V, 0°C-70°C, 8-DIP (0.300", 7.62mm), Tube.

$0.97Ref. price · indicative, final on quote
Packaging8-DIP (0.300", 7.62mm)
RoHSROHS3 Compliant
SeriesLinCMOS™
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TLC555CP specifications
ParameterValue
Type555 Type, Timer/Oscillator (Single)
SeriesLinCMOS™
MountingThrough Hole
Voltage2V ~ 15V
Current - supply360 µA
Frequency2.1MHz
Operating temperature0°C ~ 70°C
PackageTube
Case8-DIP (0.300\", 7.62mm)

Product details

2.1 MHz timing ceiling and 360 µA draw — the LinCMOS trade-off

The TLC555CP is a LinCMOS™ 555-type timer/oscillator that runs up to 2.1 MHz, drawing 360 µA typical supply current at 2 V. That 2.1 MHz ceiling is the maximum astable frequency — the RC time constant sets the actual output period, and at this speed the propagation delay through the comparator and output stage starts to limit the minimum pulse width. For a one-shot monostable, the 2.1 MHz figure means the output pulse can be as short as roughly 475 ns before the internal logic misses the trigger edge. The 360 µA supply at 2 V is the low-power advantage over a bipolar 555 (which typically pulls several mA). In a battery-powered timer circuit — say a watchdog timeout on a single Li-ion cell — the TLC555CP's own draw is comparable to the leakage of the decoupling capacitor, so it adds negligible drain to the sleep budget.

2 V to 15 V supply — single-cell Li-ion to 12 V rail

The lower end at 2 V is below the minimum for a standard bipolar 555 (typically 4.5 V), so this part works in deeply-discharged battery circuits or 3 V coin-cell systems where the rail sags under load. An outdoor sensor node or under-hood timer needs the industrial-grade sibling (TLC555I, -40°C to 85°C) to guarantee timing accuracy across the temperature swing.

8-DIP through-hole — breadboard and protoboard fit

The 8-DIP (0.300" row spacing, 7.62 mm) package is the standard dual-inline footprint that fits solderless breadboards, perfboard, and socketed PCB layouts. The 2.54 mm pin pitch is hand-solderable and reworkable without hot air. For a one-off prototype or a low-volume repair, the through-hole package avoids the stencil and reflow step that a surface-mount 555 would require.

Active lifecycle — no end-of-life risk for new designs

The LinCMOS™ series is a mature process family, so the die shrink or wafer-fab changes that trigger PCNs are unlikely. If a future EOL does occur, the pin-compatible bipolar NE555P (also 8-DIP) is a functional fallback, though the supply current and minimum voltage differ — the TLC555CP's 2 V floor and 360 µA draw are not matched by the bipolar part.