Quad op-amp in a through-hole DIP — breadboard and legacy socket fit
It belongs to the LinCMOS™ family, which combines CMOS input stages — 1 pA typical input bias current — with rail-to-rail output swing. That means it can condition signals from high-impedance sensors (photodiodes, piezoelectric elements, pH probes) without loading the source, and swing the output close to both supply rails on a single 4.4 V to 16 V rail. Each of the four amplifiers draws 850 µA typical supply current, so the whole package burns about 3.4 mA quiescent — a decent fit for battery-powered or thermally constrained analog front-ends that need four channels.
730 kHz GBW and 0.55 V/µs slew — where the speed lands
730 kHz gain-bandwidth means a closed-loop gain of 10 gives you 73 kHz of usable bandwidth; at gain 100 you get 7.3 kHz. That's enough for thermocouple amplifiers, strain-gauge bridges, audio line-level stages, and active filters below 20 kHz. The 0.55 V/µs slew rate limits large-signal response — a 10 V peak-to-peak step slews in about 18 µs, so don't push square-wave or pulse applications above roughly 30 kHz full swing. For faster signals you'd step up to the TLV9351 family (3.5 MHz) or a higher-slew CMOS part.
Through-hole DIP — repair bench and low-volume production
The 14-DIP package (7.62 mm body width) is the standard 0.300" DIP footprint. It's socket-friendly for prototyping and field-repairable without hot air. For high-volume SMT assembly, TI offers surface-mount equivalents in SOIC and TSSOP (e.g., TLC2264AID, TLC2264AIPW), but the CN suffix specifically locks you into the through-hole form.
TI lists the TLC2264CN as Active (current production). ROHS3 compliant, no lead-free transition risk. For a new design that needs a through-hole quad op-amp, this part has no imminent LTB clock — you can qualify it without stockpiling.