THS4541QWRGTRQ1

Texas Instruments · Automotive, AEC-Q100 Series

Texas Instruments THS4541QWRGTRQ1, Automotive AEC-Q100 differential amplifier, 1 circuit, 1500 V/µs slew rate, 620 MHz -3dB bandwidth, rail-to-rail output, 2.7 V to 5.4 V supply, 16-VQFN (3x3) package, -40°C to 125°C.

Texas Instruments THS4541QWRGTRQ1
Download datasheet (PDF)
[IN STOCK] In Stock: 7 pcs
$12.88/ pc

Volume pricing

Buy Now

MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

THS4541QWRGTRQ1 specifications
Parameter / AttributeSpecification / Value
SeriesAutomotive, AEC-Q100
Output typeRail-to-Rail
MountingSurface Mount
Amplifier typeDifferential
Voltage - input offset100 µV
Voltage - supply span5.4 V
Current - supply10.1mA
Current - input bias10 µA
Current - output (Channel)100 mA
Operating temperature-40°C ~ 125°C (TA)
-3db bandwidth620 MHz
Gain bandwidth product850 MHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate1500V/µs
Case16-VFQFN Exposed Pad
Number of circuits1

Technical details

Differential amp for automotive high-speed signal chains

Output current capability of 100 mA per channel lets it drive multiple ADC inputs or a 50 Ω back-terminated cable directly.

A slew rate of 1500 V/µs means this amplifier can reproduce a 10 V peak-to-peak signal at frequencies up to roughly 48 MHz before slew-rate limiting begins to distort the waveform. For a 2 V peak-to-peak signal typical of modern ADC inputs, the full-power bandwidth extends well past 200 MHz. This headroom matters when the signal chain includes sharp anti-aliasing filter roll-offs or when the amplifier must settle to 12-bit accuracy within one clock cycle of a 50 MSPS or faster ADC. The 850 MHz gain-bandwidth product supports closed-loop gains up to 10 or more while still maintaining useful bandwidth above 60 MHz, which covers most automotive sensor IF and baseband signals.

Automotive temperature range and supply flexibility

The 10.1 mA supply current is a reasonable trade-off for the speed — expect to budget for it in the thermal analysis, especially at 125°C.

Package and landing pattern

The 16-VQFN (3x3 mm) package with exposed thermal pad requires a via-stitched ground pad under the package for adequate thermal dissipation.

For volume production, confirm lead time at the time of your RFQ — the spot market for automotive-grade high-speed amplifiers can tighten during industry-wide allocation cycles.

THS4541QWRGTRQ1
[ALLOC] verified
Quote