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Texas Instruments SN75LBC174ADW — Logic ICs

SN75LBC174ADW Quad RS-422/RS-485 Driver 30 Mbps 20-SOIC

MPNSN75LBC174ADW
End of Life

Texas Instruments SN75LBC174ADW, quad RS-422/RS-485 line driver, 30 Mbps data rate, 4.75 V to 5.25 V supply, 0°C to 70°C, 20-SOIC wide-body package.

$8.7Ref. price · indicative, final on quote
Texas Instruments SN75LBC174ADW datasheet (PDF)
Packaging20-SOIC (0.295", 7.50mm Width)
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

SN75LBC174ADW specifications
ParameterValue
TypeDriver
MountingSurface Mount
Supply voltage4.75V ~ 5.25V
ProtocolRS422, RS485
Operating temperature0°C ~ 70°C
PackageTube
Data rate30Mbps
Case20-SOIC (0.295\", 7.50mm Width)
Number of drivers (Receivers)4/0

Product details

30 Mbps quad driver for RS-422/RS-485 buses

The SN75LBC174ADW is a quad RS-422/RS-485 line driver from Texas Instruments, delivering a 30 Mbps data rate over a 4.75 V to 5.25 V supply range. With four drivers and no receivers (4/0 configuration), it is designed for simplex or transmit-only bus nodes where the receiver function is handled elsewhere on the board.

20-SOIC wide-body footprint and commercial temperature range

Housed in a 20-SOIC package with a 7.50 mm body width, the SN75LBC174ADW requires a wide-body SOIC-20 land pattern — not the narrow 3.9 mm variant.

Frequently asked questions

What is the maximum data rate of the SN75LBC174ADW?

The SN75LBC174ADW supports a maximum data rate of 30 Mbps over RS-422 or RS-485 links.

What package does the SN75LBC174ADW come in?

It comes in a 20-SOIC wide-body package (0.295-inch / 7.50 mm width) with surface-mount termination.

Is the SN75LBC174ADW a suitable replacement for the SN75LBC174AN?

The SN75LBC174AN is a DIP-20 through-hole version of the same quad driver. The SN75LBC174ADW is the surface-mount equivalent in a 20-SOIC wide package. Electrical specifications are identical, but the package and mounting method differ — confirm the board footprint and assembly process before substituting.