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Texas Instruments SN75451BP — Logic ICs

SN75451BP Peripheral Driver, 300 mA, Open Collector, 8-DIP

MPNSN75451BP
End of Life

Texas Instruments SN75451BP, dual peripheral driver, open-collector output, 300 mA per channel, 4.75 V to 5.25 V supply, 8-DIP through-hole package, 0°C to 70°C operating temperature.

$0.94Ref. price · indicative, final on quote
Packaging8-DIP (0.300", 7.62mm)
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

SN75451BP specifications
ParameterValue
Logic typePeripheral Driver
Output typeOpen Collector
MountingThrough Hole
Supply voltage4.75V ~ 5.25V
Current - output high, low-, 300mA
Operating temperature0°C ~ 70°C (TA)
PackageTube
Case8-DIP (0.300\", 7.62mm)
Number of elements2
Number of bits per element2

Product details

300 mA per channel — sizing the load budget

The headline output rating is 300 mA per driver, specified for the low-side (sinking) current only — there is no high-side sourcing capability, as the outputs are open-collector. When sizing the load, remember that both channels share the same package thermal path; driving both near the 300 mA limit simultaneously at 70°C ambient requires checking the derating curve. For a single relay or lamp load at 200 mA, the SN75451BP runs cool with margin.

Through-hole 8-DIP — board fit and rework

The 8-DIP (0.300" row spacing) package is a through-hole part, which means it plugs into a socket or solders into plated-through holes. For prototyping, a DIP socket lets you swap drivers without desoldering. In production, through-hole adds assembly cost versus surface-mount, but for low-volume builds, legacy board repairs, or designs where vibration resistance from a socketed part matters, the 8-PDIP form factor is deliberate.

Frequently asked questions

How much output current can SN75451BP drive?

Each of the two driver channels can sink up to 300 mA with the open-collector output. There is no high-side source current — the output is a switched ground path. For loads near 300 mA on both channels simultaneously, consider the package thermal limits at the 70°C maximum ambient.