Active triple buffer in a 1.9x0.9 mm DSBGA
The SN74LVC3G17YZPR: Each of the three elements handles one bit, giving you three clean signal paths in a footprint that fits under a fingernail — useful when board real estate is tighter than a standard SOIC or TSSOP allows.
Supply range and Schmitt-trigger inputs
Schmitt-trigger inputs on every channel reject noise and slow edges, so the buffer won't oscillate or double-clock on a rising edge from a long PCB trace or a sensor with a weak pull-up. Outputs are push-pull rated for 32 mA source and sink per channel — enough to drive a small LED, a relay coil through a transistor, or a short unterminated trace at moderate speed.
Package rework and board-fit
The 8-DSBGA (1.9x0.9 mm) has no exposed thermal pad and no leads — it's a wafer-level chip-scale package with solder balls directly on the die. That means no side-wetting inspection and no hand-solder path; rework needs a hot-air station with a fine nozzle and a steady hand. The supplier device package marking is 8-DSBGA (1.9x0.9) — the ball pitch is tight, so the PCB land pattern must match TI's recommended footprint exactly. A stencil aperture for 0.25 mm balls is typical.
Sourcing and compliance
The part is ROHS3 Compliant, meeting the latest EU RoHS exemption-free requirements. No additional compliance documentation (UL, IEC) is listed in the available records. Cut Tape works for prototype builds and small-batch rework.