Dual open-drain buffer in a 0.4mm-pitch BGA
Each of the two elements sinks up to 32mA, enough for an LED, a relay coil, or a bus pull-down. The 6-DSBGA package (0.4mm pitch) saves board area but demands a decent reflow profile and a clean stencil — the scorch mark on a dead board from a poorly soldered BGA is unmistakable.
The 1.65V to 5.5V supply range covers 1.8V, 2.5V, 3.3V, and 5V rails without a level shifter — just pick the pull-up voltage on the open-drain output. At the low end, 1.65V is enough for a 1.8V I/O bank; at 5.5V you can drive a legacy 5V TTL bus. If you're reworking a board that ran hot, this part won't be the first thing to drift.
Open-drain output — the real reason you pick this part
Open-drain outputs let multiple devices share a pull-up resistor — common for interrupt lines, I²C-style buses, or fault flags. The 32mA sink current handles a typical LED with a series resistor, or a 5V relay coil through a transistor driver. There's no internal pull-up, so the high-level voltage is whatever you connect the external resistor to — handy for level translation. Just remember: the output can only pull low; the pull-up resistor and load determine the rise time.
The 6-DSBGA package is a 0.4mm-pitch wafer-level chip-scale package — about 1.0mm × 1.4mm. No leads, no exposed pad; the solder balls are the only connection. Reflow profile needs a peak temperature around 260°C (lead-free), and the board layout must match the TI-recommended footprint exactly. A hot-air rework station can remove it, but the tiny balls make alignment finicky; a stencil and paste are safer.
It's ROHS3 compliant.
