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Texas Instruments SN74LVC1G11DRYR — Logic ICs

SN74LVC1G11DRYR 3-Input AND Gate, 1.65-5.5 V, 6-SON

MPNSN74LVC1G11DRYR
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Texas Instruments 74LVC series single 3-input AND gate, SN74LVC1G11DRYR, 1.65 V to 5.5 V supply, 32 mA output drive, 3.5 ns propagation delay at 5 V, -40°C to 125°C, 6-SON package.

$0.4800Ref. price · indicative, final on quote
Texas Instruments SN74LVC1G11DRYR datasheet (PDF)
Packaging6-UFDFN
RoHSROHS3 Compliant
Series74LVC
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

SN74LVC1G11DRYR specifications
ParameterValue
Series74LVC
Logic typeAND Gate
MountingSurface Mount
Supply voltage1.65V ~ 5.5V
Current - quiescent10 µA
Current - output high, low32mA, 32mA
I/O channels3
Operating temperature-40°C~125°C
PackageTape & Reel (TR); Cut Tape (CT)
Case6-UFDFN
Number of circuits1
Input logic level - low0.7V ~ 0.8V
Input logic level - high1.7V ~ 2V
Max propagation delay @ v, max CL3.5ns @ 5V, 50pF

Product details

Single 3-input AND gate in a 6-SON package

The output can source or sink 32 mA, and propagation delay is 3.5 ns at 5 V with a 50 pF load.

Supply range and logic-level compatibility

Input logic thresholds are specified: low at 0.7 V to 0.8 V, high at 1.7 V to 2 V, so it cleanly recognizes standard CMOS and TTL levels across the supply range.

Industrial temperature grade and quiescent current

Quiescent current is 10 µA maximum, keeping standby power negligible in battery-powered designs.

ROHS3 compliant. For dual-sourcing, the 74LVC family includes multi-gate AND options (e.g., SN74LVC2G08YZPR with two 2-input AND gates in a similar package), but no direct pin-compatible second source exists for this exact single-gate 3-input variant.

Frequently asked questions

What is the difference between SN74LVC1G11DRYR and SN74LVC1G11DBVR?

The DBVR variant uses a SOT-23-6 package, while the DRYR uses a smaller 6-SON (1.45x1 mm) package. Both are single 3-input AND gates with identical electrical specifications. The SON package saves board area but requires a finer-pitch solder process.