Texas Instruments 74LVC series, Inverter, 1 Circuit, 1 Input, 32mA output, 1.65V to 5.5V supply, -40°C to 85°C, 4-DSBGA (0.88x0.88) package.
| Parameter | Value |
|---|---|
| Series | 74LVC |
| Logic type | Inverter |
| Mounting | Surface Mount |
| Supply voltage | 1.65V ~ 5.5V |
| Current - quiescent | 10 µA |
| Current - output high, low | 32mA, 32mA |
| I/O channels | 1 |
| Operating temperature | -40°C~85°C |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Case | 4-XFBGA, DSBGA |
| Number of circuits | 1 |
| Input logic level - low | 0.7V ~ 0.8V |
| Input logic level - high | 1.7V ~ 2V |
| Max propagation delay @ v, max CL | 3.7ns @ 5V, 50pF |
Maximum propagation delay is 3.7 ns at 5 V driving 50 pF. Quiescent current is 10 µA maximum.
Rework requires a hot-air station with a fine nozzle; the part is too small for hand soldering. MSL is not listed in the record, but for a DSBGA of this size assume MSL 1 unless the reel label says otherwise.
The SN74LVC1G04YZVR comes in a 4-DSBGA (0.88 x 0.88 mm) package, while the SN74LVC1G04DCK uses a 5-pin SC-70 package. The electrical specifications — supply range, output drive, propagation delay, and temperature range — are the same. The choice is purely a board-area and assembly-process decision: the DSBGA saves space but requires a BGA-capable reflow line, whereas the SC-70 is easier to hand-solder and rework.
It comes in a 4-XFBGA, DSBGA package with a supplier device package size of 4-DSBGA (0.88 x 0.88 mm).