14-VQFN footprint and board integration
The SN74CBTLV3125RGYR comes in a 14-VFQFN Exposed Pad package (3.5x3.5 mm body), supplier device package 14-VQFN. The exposed pad requires a solder paste stencil aperture covering 50-70% of the pad area to avoid voids and ensure consistent solder joint height.
Four independent 1:1 bus switches
This is a 4-bit bus switch with four independent 1:1 circuits, each controlled by a separate output-enable pin. When the OE pin is low, the switch is on and the signal passes through with low on-state resistance; when high, the switch presents a high-impedance state to isolate the bus segments.
