The Texas Instruments SN74AUP3G17RSER is a triple non-inverting buffer from the 74AUP low-power logic family. Each of its three elements has a Schmitt trigger input, which provides hysteresis for clean switching on slow or noisy edges — useful when interfacing to sensors, mechanical switches, or RC-filtered signals. Outputs are push-pull, rated for 4 mA source and sink. It comes in an 8-UQFN package measuring 1.5 mm × 1.5 mm, suited for space-constrained PCBs in portable or industrial equipment.
8-UQFN footprint — layout notes
The 8-UQFN (1.5 × 1.5 mm) package is a fine-pitch, leadless land-grid array. The pad layout needs a soldermask-defined pad per the TI application note, and the small thermal pad under the package wants a via-in-pad or at least a short trace to a ground plane for heat sinking. Stencil aperture reduction helps avoid solder bridging on the 0.5 mm pitch.
It is ROHS3 compliant. For new designs, there is no last-time-buy risk.