SN74AUP2G17DSFR

Texas Instruments · 74AUP Series

Texas Instruments 74AUP series, SN74AUP2G17DSFR, Buffer, Non-Inverting, Schmitt Trigger Input, Push-Pull Output, 0.8V to 3.6V supply, 4mA output, -40 to 85°C, 6-XFDFN / 6-SON 1x1mm package.

Texas Instruments SN74AUP2G17DSFR
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[IN STOCK] In Stock: 347 pcs
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

SN74AUP2G17DSFR specifications
Parameter / AttributeSpecification / Value
Series74AUP
Input typeSchmitt Trigger
Logic typeBuffer, Non-Inverting
Output typePush-Pull
MountingSurface Mount
Supply voltage0.8V ~ 3.6V
Current - output high, low4mA, 4mA
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
Case6-XFDFN
Number of elements2
Number of bits per element1

Technical details

Dual buffer with Schmitt-trigger inputs in a 1x1mm SON

It operates across a 0.8V to 3.6V supply range, making it suited for battery-powered and low-voltage portable designs. Each of the two elements drives up to 4mA source and sink, enough to fan out to multiple CMOS logic inputs.

Supply voltage range and what it enables

The 0.8V to 3.6V supply span directly matches the core voltages of modern low-power MCUs, FPGAs, and SoCs. At the low end, it interfaces cleanly with 1.2V or 1.8V logic without an external level translator. At 3.6V it handles legacy 3.3V rails. The Schmitt-trigger input provides hysteresis that cleans up slow edges from RC debounce circuits, sensor comparators, or long PCB traces — a common need in panel interfaces and pushbutton inputs.

Package and layout reality

Housed in a 6-XFDFN (6-SON) package measuring 1x1mm, this part is sized for dense PCB layouts where every square millimetre counts — think wearable, IoT sensor nodes, or multi-channel interface modules. The small footprint means the board assembler needs to handle DFN-style packages; the 0.5mm pitch is standard for that class. No exposed thermal pad to worry about, but the tiny body demands precise stencil aperture for solder paste.

No last-time-buy or obsolescence risk on the horizon.

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