Texas Instruments 74AUP series, AND Gate, 2-Element, 2-Input, 8-XFBGA/DSBGA, Surface Mount, 0.8V to 3.6V supply, -40°C to 85°C.
| Parameter | Value |
|---|---|
| Series | 74AUP |
| Logic type | AND Gate |
| Mounting | Surface Mount |
| Supply voltage | 0.8V ~ 3.6V |
| Current - quiescent | 500 nA |
| Current - output high, low | 4mA, 4mA |
| I/O channels | 2 |
| Operating temperature | -40°C ~ 85°C |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Case | 8-XFBGA, DSBGA |
| Number of circuits | 2 |
| Input logic level - low | 0.7V ~ 0.9V |
| Input logic level - high | 1.6V ~ 2V |
| Max propagation delay @ v, max CL | 6.7ns @ 3.3V, 30pF |
The SN74AUP2G08YFPR: This part comes in an 8-bump DSBGA package, designated 8-DSBGA. It is a surface-mount device intended for direct soldering to a PCB.
Suitable for outdoor telecom cabinets, factory-floor sensors, and consumer electronics that see temperature swings. Not qualified for automotive under-hood or military avionics — those require extended-range or AEC-Q100 parts. Storage temperature exceeds the operating range, but the device should not be run beyond the rated limits.
Yes, it is ROHS3 compliant.
The device is an 8-bump DSBGA. The pinout follows the standard dual-gate AND arrangement: each gate has two inputs (A and B) and one output (Y). The exact bump mapping is in the TI datasheet; the supplier device package is 8-DSBGA.
The SN74AUP2G08YZPR is a close functional equivalent — same 74AUP2G08 AND-gate die, same supply range and speed. The difference is the package suffix; verify the DSBGA footprint matches your board layout before substituting.
This part is available to order through independent distribution. Submit an RFQ for current pricing and availability — stock and lead time are confirmed at quote time, not listed here.