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Texas Instruments SN74AUP1G08DRY2 — Discrete Semiconductors

SN74AUP1G08DRY2 AND Gate, 0.8-3.6V, 500nA Quiescent

MPNSN74AUP1G08DRY2
End of Life

Texas Instruments 74AUP series AND Gate, SN74AUP1G08DRY2, single 2-input, 0.8V to 3.6V supply, 500 nA quiescent, 6-SON (1.45x1) package, surface mount.

$0.54Ref. price · indicative, final on quote
Packaging6-UFDFN
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

SN74AUP1G08DRY2 Technical Specifications
ParameterValue
Series74AUP
Logic typeAND Gate
Mounting typeSurface Mount
Voltage0.8V ~ 3.6V
Current - quiescent500 nA
Current - output high, low4mA, 4mA
Number of inputs2
Operating temperature-40°C ~ 85°C
PackageTape & Reel (TR); Cut Tape (CT)
Case6-UFDFN
Number of circuits1
Input logic level - low0.7V ~ 0.9V
Input logic level - high1.6V ~ 2V
Max propagation delay @ v, max CL6.2ns @ 3.3V, 30pF

Product details

Single 2-input AND gate in the 74AUP family

The SN74AUP1G08DRY2 is a single 2-input AND gate from Texas Instruments' 74AUP series, a logic family built for ultra-low-power operation in battery and portable designs. The 6.2 ns propagation delay at 3.3 V with a 30 pF load keeps signal paths fast enough for most low-frequency control and sensor interface logic.

Input logic thresholds scale with supply: low level is 0.7 V to 0.9 V, high level is 1.6 V to 2.0 V — these are the decision points the gate uses to interpret incoming signals, not the output drive levels. Output drive is rated 4 mA source and 4 mA sink at the rated supply — enough to drive a single LED indicator or the input of a following logic stage, but not a relay coil or bus line without a buffer.

Housed in a 6-UFDFN package (supplier device package 6-SON, 1.45 mm x 1.0 mm), this is a tiny, leadless package suited for space-constrained PCBs in wearables, sensors, and handheld devices. The 0.5 mm pitch and exposed pad require a solder stencil with appropriate aperture design and a reflow profile matched to the leadless package — not a hand-solder part for prototyping without a hot-air station.

The part is ROHS3 compliant, meeting the latest EU restriction-of-hazardous-substances directive for lead-free assembly.

Frequently asked questions

How do I get current pricing and availability for SN74AUP1G08DRY2?

Submit an RFQ through this listing. The part is sourced to order against your BOM quantity.