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Texas Instruments SN65LVDS387DGGRG4 — Interface & Transceivers

TI SN65LVDS387DGGRG4 LVDS Driver, 630 Mbps, 64-TSSOP

MPNSN65LVDS387DGGRG4
End of Life

Texas Instruments 65LVDS series LVDS Driver, 16 driver, 0 receiver, 630 Mbps data rate, 3V to 3.6V supply, -40°C to 85°C, 64-TSSOP package, Tape & Reel.

$58.8000Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

SN65LVDS387DGGRG4 specifications
ParameterValue
TypeDriver
Series65LVDS
MountingSurface Mount
Supply voltage3V ~ 3.6V
ProtocolLVDS
Operating temperature-40°C~85°C
PackageTape & Reel (TR)
Data rate630Mbps
Case64-TFSOP (0.240\", 6.10mm Width)
Number of drivers (Receivers)16/0

Product details

16-channel LVDS driver at 630 Mbps — what the data rate buys you

The Texas Instruments SN65LVDS387DGGRG4 is a 16-channel LVDS driver in the 65LVDS family, designed to push parallel data or clock signals across differential pairs at rates up to 630 Mbps per channel. With sixteen drivers and zero receivers on-chip, this is a pure transmit-side buffer — you pair it with a separate LVDS receiver array on the far end of the cable or backplane. The 630 Mbps rating means each channel can serialize a 10-bit parallel word at 63 MHz or a 16-bit word at 39.375 MHz, giving you the headroom for high-resolution video links, high-speed data acquisition backplanes, or clock distribution trees where jitter budget is tight.

Supply and temperature — where this driver lives

No external voltage translation needed if your FPGA or ASIC already swings 3.3V CMOS into the driver inputs. If your application stays inside a climate-controlled rack, the commercial end of that range is fine; if the board sits near a hot motor drive or an unvented enclosure, the -40°C low end and 85°C high end give you the margin without stepping up to a mil-spec part.

Package and footprint — 64-TSSOP

Housed in a 64-TSSOP package (0.240" body width, 6.10 mm), the part is a surface-mount device intended for automated assembly. The 0.5 mm pitch fine-pitch TSSOP footprint is common on multilayer boards; route the 16 differential output pairs with controlled impedance (typically 100 Ω differential) and keep the trace length matched within a few mm to preserve signal integrity at 630 Mbps. The package is rated for standard reflow profiles — no exotic handling beyond MSL precautions.

TI lists the SN65LVDS387DGGRG4 as Active. No need to qualify a replacement or stockpile for an imminent phase-out.

Frequently asked questions

What is the SN65LVDS387DGGRG4 used for?

It is a 16-channel LVDS driver that converts parallel CMOS/TTL signals into differential LVDS outputs at up to 630 Mbps per channel. Typical applications include high-speed backplane interconnects, flat-panel display links, and clock distribution in telecom or industrial equipment where low noise and high data integrity over twisted-pair or PCB traces are required.

Does the SN65LVDS387DGGRG4 have an equivalent replacement?

Within the same 65LVDS family, the base product number 65LVDS387 covers multiple package and tape options. The SN65LVDS387DGGRG4 is the Tape & Reel variant of the 64-TSSOP package. For a pin-compatible alternative, look at other 65LVDS387 devices in the same 64-TSSOP footprint; they share the same driver architecture and data rate rating.

Is the SN65LVDS387DGGRG4 RoHS compliant?

The part carries the G4 suffix, which indicates TI's green (RoHS) and halogen-free designation. It is compliant with the RoHS directive and free of lead, mercury, cadmium, and other restricted substances as defined by TI's material declaration.